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Related Topics: Wearables, Java IoT, Microservices Expo, Open Source Cloud, Containers Expo Blog, @CloudExpo, @BigDataExpo, SDN Journal

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SYS-CON Announces WebRTC Summit

WebRTC Summit is the world's leading event on the Real Time Communication (RTC) capabilities

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SYS-CON Events announced today that the "First International WebRTC Summit" (@WebRTCSummit) will take place Nov 6-7, 2013, at the Santa Clara Convention Center, Santa Clara, CA.

WebRTC (Web Real-Time Communication) is an open source project supported by Google, Mozilla and Opera that aims to enable browser-to-browser applications for voice calling, video chat, and P2P file sharing without plugins. Its mission is "To enable rich, high quality, RTC applications to be developed in the browser via simple Javascript APIs and HTML5."

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A survey by TokBox found that the WebRTC adoption rate among small organizations is growing quickly where over 25% of developers say it is important for their work.

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WebRTC Summit will feature two full days of technical sessions from a rock star conference faculty and the leading WebRTC industry players. WebRTC Summit is co-located with 13th International Cloud Expo and 4th International Big Data Expo.

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About SYS-CON Media & Events
SYS-CON Media (www.sys-con.com) has since 1994 been connecting technology companies and customers through a comprehensive content stream at www.sys-con.com - featuring over forty focused subject areas, from Cloud Computing to Web Security - interwoven with market-leading full-scale conferences produced by SYS-CON Events. The company's internationally recognized brands include among others Cloud Expo®(www.CloudComputingExpo.com), Big Data Expo (http://BigDataExpo.net), SDN Expo (http://SDNexpo.co), Virtualization Conference & Expo (www.VirtualizationConference.com), Government IT Conference & Expo (www.GovITExpo.com), and Cloud Computing Bootcamp (www.CloudComputingBootcamp.com).

Cloud Exp, Cloud Expo® East, Cloud Expo® West, Cloud Expo® New York, Cloud Expo® Silicon Valley, Cloud Expo® Europe, Cloud Expo® Tokyo, Cloud Expo® Prague, Cloud Expo® Hong Kong, Cloud Expo® Sao Paolo are trademarks and /or registered trademarks (USPTO serial number 85633366, registration no. 4378577) of Cloud Expo, Inc.

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